Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates

Mohd Izrul Izwan Ramli, and Mohd Arif Anuar Mohd Salleh, and Siti Farahnabilah Muhd Amli, and Nurul Razliana Abdul Razak, (2020) Effect of bismuth additions on wettability, intermetallic compound, and microhardness properties of Sn-0.7Cu on different surface finish substrates. Sains Malaysiana, 49 (12). pp. 3255-3259. ISSN 0126-6039

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Official URL: https://www.ukm.my/jsm/malay_journals/jilid49bil12...

Abstract

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish.

Item Type:Article
Keywords:Bismuth; Solder alloy; Surface finish; Wettability
Journal:Sains Malaysiana
ID Code:16190
Deposited By: ms aida -
Deposited On:10 Feb 2021 03:34
Last Modified:13 Feb 2021 15:11

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