Number of items: 2.
Atiqah Mohd Afdzaluddin, and Maria Abu Bakar,
(2020)
Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test.
Sains Malaysiana, 49
(12).
pp. 3029-3036.
ISSN 0126-6039
Rabiah Al Adawiyah Ab Rahim, and Muhammad Nubli Zulkifli, and Azman Jalar, and Atiqah Mohd Afdzaluddin, and Kim, Siow Shyong
(2020)
Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS).
Sains Malaysiana, 49
(12).
pp. 3045-3054.
ISSN 0126-6039
This list was generated on Thu Apr 25 11:28:19 2024 MYT.
