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Items where Author is "Kim, Siow Shyong"

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Rabiah Al Adawiyah Ab Rahim, and Muhammad Nubli Zulkifli, and Azman Jalar, and Atiqah Mohd Afdzaluddin, and Kim, Siow Shyong (2020) Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS). Sains Malaysiana, 49 (12). pp. 3045-3054. ISSN 0126-6039

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