Mohd Nasir Tamin, and Liew, Yek Ban (2008) Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue. Jurnal Kejuruteraan, 20 . pp. 95-106.
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| Item Type: | Article |
|---|---|
| Journal: | Jurnal Kejuruteraan |
| ID Code: | 2566 |
| Deposited By: | Ms. Nor Ilya Othman |
| Deposited On: | 04 Aug 2011 06:55 |
| Last Modified: | 14 Dec 2016 06:31 |
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